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Successfully Implement the

Revised USP <467>Method

Continu ed from page 3.

Figure 3

USP residual solvent Class 2 Mixtu re A standard solut ion on an Rtx®-1301 column (G43).

2.acetonitrile (resolution

=

1.35) 3

3. dichloromethane

I

4.0

4.2

4.4

4.6

l. methanol

10. toluene

2. acetonitrile (resolution= 1.35) ll. chlorobenzene

3. dichloromethane

12. ethyl benzene

--¥sYSTEM SUITABILITYCRITERIAMET

....... ,1\.., ....

,_

9. 1,4-dioxane

9

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I

I

I

I

Ii

14.8 15.0 15.2

i

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i

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I

15.4 156 15.8 16.0

10

20

GCPH00910

4. trans-l,2-dichloroethene

13.

m-xylene/p-xylene

5. cis-l,2-dichloroethene

14. o-xylene

6. tetrahydrofuran

7. cyclohexane

8. methylcyclohexane

9. l ,4-dioxane

Column:

Rtx"-624, 30m,0.32!D, l. 8IJm(caL# 10970)

13

12

n\

Sample:

USP < 467> Class 2 Mixture

A

standard solution (caL# 36271)

in 20mL headspace vial

Inj.:

headspaceinjection (split ratio 1:5),

l rnrn

split liner, Siltek" deactivated

(caL# 20972-214.1)

Inj. temp.:

140"C

Carrier gas:

helium,constantflow

Flow rate:

2.16mL/min., 35.3cm/sec.

Oven temp.:

40"Cfor 20min. to 240"C@

10"C/min. (holdfor 20min.)

Del.:

F!D @240"C

HeadspaceConditions

Instrument:

Tekmar HT3

Transfer line temp.:

lO5°C

Valve oven temp.:

105°C

Sample temp.:

80"C

Sample

equil,

time:

45min.

14

Vial pressure:

10psi

Pressurizetime:

0.5 min.

Loop fill pressure:

5psi

Loopfill time:

2.00min.

Inject time:

l. 00 min.

30min.

Figure 4

USP residual solvent Class 2 Mi xtu re B standard solution on an Rtx®-1301 column (G43).

5

7

3

--L

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I

8

i

1

4

I

10

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12

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14

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16

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18

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20

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6

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22

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24

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26

8

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12

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3 4

I

10

i

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~

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20

I

6

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7

i

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30

I

I

min.

i

i

I

GCPH00911

l. hexane

2. nitromethane

3. chloroform

4. l,2-dimethoxyethane

5. trichloroethylene

6. pyridine

7. 2-hexanone

8. tetralin

Column:

Rtx"'624, 30m,0.32mm!D, l.8J1m(caL# 10970)

Sample:

USP < 467> Class 2 Mixture

B

standard solution (caL# 36280)

in 20mLheadspace vial

Inj.:

headspace injection (split ratio 1:5),

l rnrn

split

liner

Siltek"

deactivated(caL# 20972-214.1)

Inj. temp.:

140°C

Carier gas:

helium,constant flow

Flow rate:

2.16mLlmin., 35.3cm/sec.

Oven temp.:

40°Cfor 20 min. to 240"C@

10°C/ min. (hold for 20 min.)

Del.:

F!D@ 240"C

HeadspaceConditions

Instrument:

Tekmar HT3

Transfer line temp.:

105°C

Valve oven temp.:

105°C

Sample temp.:

80°C

Sample equil. time:

45 min.

Vial pressure:

lOpsi

Pressurizetime:

0.5 min.

Loopfill pressure:

5psi

Loop fill time:

2.00 min.

Inject time:

l.00 min.

I

i

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· 4·

www.restek.com

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www.chromtech.net.au

E-mail :

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